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automatic calculation of encapsulated resin volumes

  • Thread starter Thread starter fabrizio_brescia
  • Start date Start date

fabrizio_brescia

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good morning to all, we are still working with the wf4, for modeling electronic cards is enough. I asked a question to my technicians who couldn't answer, or if there is an automatic way to know the volume of the encapsulated resin of an electronic card placed in a container.
the board and its components are all shaped, basically I should know the difference between the volume of the container and that of the electronic card. In this way I hypothesize to resin the whole box.
Alternatively you could draw the resin as solid and even the board, exporting it and then reimporting it could be solidified. making the difference between the 2 solids I should get the volume of the resin that occupies the empty spaces.
Can someone give us any indication on the correct method to get this data?

Thank you.
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I used to do something like that.
I built the axieme without resin and asked for mechanical properties (now I don't remember the exact command) and I also got out the volume.
I added a protrusion that simulated the resin and asked the properties again.
And I made a difference.
take into account that the resin, at least the epoxy, may encounter hidden pockets that do not fill; and if there are details that you protect (magari coils or condensers glued to make them stand still) the calculated volume is no longer correct.
If you make an empty resin there may be gas bubbles that reduce the volume, as well as quality.
Finally, my experience, the machine that resin with multiple nozzles could have differences between one and the other and reach different levels.
 
mass property of the component and/or together, the values are all calculated (named "pro_xxxxx") and the editable ones that override the calculated ones (named "pro_alt_xxxx") is up to you to decide what and how to exploit them.
having the wildifire 4 you are a little limited in this, especially if you use the "flexibility" granted in the assemblies (which here in my opinion would be very useful).
 
I always created a part that represented the resin.
to do so I created its gross volume obtained with copy of the inner surfaces of the box and a flat surface that represented the level that had to reach the resin.
I then went together to extract from the gross volume of the resin the volume of the electronic card, thus obtaining the exact volume of the resin.
 

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